- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Patent holdings for IPC class H01L 21/683
Total number of patents in this class: 12358
10-year publication summary
789
|
992
|
1124
|
1356
|
1443
|
1456
|
1311
|
1169
|
1038
|
339
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Applied Materials, Inc. | 16587 |
1158 |
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1119 |
Tokyo Electron Limited | 11599 |
727 |
Disco Corporation | 1745 |
402 |
Lam Research Corporation | 4775 |
360 |
Samsung Electronics Co., Ltd. | 131630 |
348 |
NGK Insulators, Ltd. | 4589 |
206 |
Lintec Corporation | 1915 |
163 |
Intel Corporation | 45621 |
144 |
Kyocera Corporation | 12735 |
139 |
Infineon Technologies AG | 8189 |
132 |
Sumitomo Osaka Cement Co., Ltd. | 783 |
124 |
Micron Technology, Inc. | 24960 |
121 |
ASML Netherlands B.V. | 6816 |
108 |
Shinko Electric Industries Co., Ltd. | 1186 |
93 |
STATS ChipPAC Pte. Lte. | 1516 |
93 |
Semiconductor Components Industries, L.L.C. | 5345 |
90 |
Advanced Semiconductor Engineering, Inc. | 1546 |
90 |
International Business Machines Corporation | 60644 |
89 |
Nikon Corporation | 7162 |
87 |
Other owners | 6565 |